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PRODUCTS

Overview

AG3335A series is a highly integrated System-in-Package (SiP), low-power, RFSoC GPS receiver with an application processor, GPS L1 and L5 receiver, a power management unit (PMU), a 4MB flash and a 4MB Pseudo SRAM (PSRAM).

AG3335A series contains an ARM® Cortex®-M4F application processor that can operate in a range of frequencies between 26MHz and 530MHz, and achieve high performance and power efficiency with Level one cache (L1 cache).

The GPS subsystem contains the RF and baseband circuits, which are able to track L1+L5 satellites at the same time, and search GPS satellites using the L1 circuit.

The PMU contains five ultra-low quiescent current low-dropout linear regulators (LDO) to provide a stable power source for the internal and external devices.

The SiP package technology combine the main die, PMU, flash, and PSRAM. This significantly reduces the product size and provides more features in the same space.

Multi –GNSS receiver

·       L1 and L5 dual-band GPS receiver with host functionality

·       Multi-frequency GPS/GLONASS/Galileo/ BeiDou/NavIC receiver

·       Support for multi-GNSS including QZSS and SBAS ranging

·       Integrated 12 multi-tone active interference cancellers

·       RTCM ready (RTCM v2.3 and v3.3)

·       Indoor and outdoor multi-path detection and compensation

·       RTK, with maximum fixed update rate up to 10Hz (AG3335AT only support 1Hz)

Software features

·       EPOTM orbit prediction

·       EASYTM self-generated orbit prediction

·       LOCUSTM logger function

·       Support for time service application, which is achieved by the PPS vs NMEA feature

Microcontroller subsystem

·       530MHz ARM® Cortex®-M4 with FPU and MPU

·       MCU operating frequency at 26, 192, 384, and 530MHz

·       17 DMA channels

·       One RTC timer, eight 32-bit general purpose timers

·       Development support: SWD, JTAG

·       Crypto engine
o   AES 128/192/256 bits

o   SHA-1/224/256

·       True random number generator

·       Secure boot, anti-clone, and anti-rollback

·       JTAG password protection

Memory

·       Up to 664KB SYSRAM, with zero-wait state and 265MHz maximum frequency

·       80kB retention SRAM

·       Up to 32KB L1 cache, with high hit rate, zero-wait state and 530MHz maximum frequency

·       Embedded 32Mbits flash memory
o   Sleep current 200nA

o   Maximum frequency 104MHz

·       Embedded 32Mbits pseudo SRAM
o   Sleep current 10µA

o   Maximum frequency 192MHz

·       Support for external SPI SRAM

o   Maximum speed 26Mhz

·       AESOTF (AES on-the-fly) to secure the data stored in flash

Communication interfaces

·       USB 2.0 device

·       One SDIO 2.0 master

·       Two I2C master (3.4Mbps) and one I2C slave interfaces

·       Three UART interfaces (3Mbps, with hardware flow control)

·       Two SPI masters and one SPI slave

·       Three PWM channels

·       4 channel 10-bit AUXADC (PinMux with GPIO), maximum input voltage 1.8V

·       Embedded thermal sensor


Power management

·       Integrated LDO regulators with low quiescent current for RTC, RF frontend and GPIOs

·       Support for external wakeup

·       Over-current and thermal overload protection

·       Under voltage lockout protection

·       Operating temperature from -40°C to 85°C


Clock source

·       Support 26/48MHz TCXO

·       Support 32kHz crystal oscillator for RTC
 

Package

·       4.2mm x 4.2mm x 1.066mm TFBGA with 0.4mm ball pitch